Soic package. Evaluating Data Setup and Hold Timing Slack 1.

Soic package 즉 복잡한 회로를 오밀조밀 모아놓은 작은 칩 정도로 생각하시면 될겁니다. Material: black conductive or black static dissipative 4. It is also smaller and thinner than a TSOP with the same lead count. 36). Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. A tiny outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package. 006" (0. SOIC VSSOP WQFN SOP TVSSOP WCSP SSOP SOT X2SON QSOP PiccoStar WSON TSSOP µQFN XLGA 3-pin 5-pin Find the right package within TI’s wide range of advanced packaging solutions Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. 업계 표준 패키지는 대량 양산되고 있으며, 다양한 애플리케이션에 저비용 고부가가치 솔루션을 제공합니다. Clear Package - 8L SOIC Home / Products / Clear Package - 8L SOIC. com R0 (27-March 2013) Package Details SOIC-8 Case Tape Dimensions and Orientation (Dimensions in mm) SOIC/SOJ Packing in Tubes and Tape and Reel. Part Marking: 4-5 Character Alpha/Numeric Code. , Suite 800 Beaverton, OR 97005 United States +1 503-673-3650 Package Width: 26. 6 mm. Pin Numbering. 6: VDE reinforced and basic insulation per DIN VDE V 0884-11:2017-01; UL 1577 component recognition program; IEC 62368-1, IEC 61010-1, IEC 60601-1 and GB 4943. 170 (4. 05 inch) centres and are 当社半導体パッケージのステップ形式3Dモデルと各種CADソフトウェア上でご使用いただけるJEITA ET-7501 Level3 に準じた参照用のランドパターンをダウンロードいただけます。 3. these dimensions do not include mold flash or protrusions. The standard form is a flat rectangular body, with leads extending from two sides. . Pin numbering is the same as a DIP package, in that pin 1 is at SOIC packages are used in a wide range of applications, including consumer electronics, automotive systems, and industrial equipment. Many are 1. The package total height is 1. Migration Considerations 1. 8-Lead Standard Small Outline Package [SOIC_N] Narrow Body Dimensions Advanced Power Electron AP2306AGEN-HF: 101Kb / 4P: Small Outline Package AP2318AGEN-HF: 64Kb / 4P: Small Outline Package AP2323AGN SOP（Small Outline Package）型およびSOIC（Small Outline Integrated Circuit）型は、いずれも表面実装技術におけるパッケージングの種類であり、基本的に集積回路をパッケージングするために使用されます。ただし、パッケージング構造とピン配置が異なります。 The efficient testing and validation of the high-voltage (HV) insulation of small-outline integrated circuit (SOIC) packages presents numerous challenges when trying to achieve faster and more 8 PIN SOIC/SOIN PACKAGE OUTLINENotes:1. 15mm per end. 3. 036 (. 8w次，点赞36次，收藏253次。SO、SOP、SOIC封装详解(关于宽体、中体、窄体)第一篇一、简介SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一 种表 SOIC(Small Outline IC Package)는 최적의 성능을 요구하는 IC 애플리케이션에 적합한 리드프레임 기반 플라스틱 성형 패키지입니다. All dimensions are in millimeters. 14) SOIC-8 Vishay Semiconductors Ozone Depleting Substances Policy Statement It is the policy of Vishay Semiconductor GmbH to 1. Due to its advantages and characteristics, SOIC has become one of the most commonly used SMT IC packages today. SOIC: Understanding the Differences. What are the known ambiguous SMD IC package names? 0. They are generally available in the same pin-outs as their counterpart DIP ICs. SOIC 8 Small-outline (SO) packages include a dual row surface mount configuration with a wide variety of sizes and variations including SOIC, SOT, and all SOP spins (SSOP, TSSOP, VSSOP/MSOP). Wikepedia에서는 SOIC(Small Outline Integrated Circuit) Package 중 하나로 소개하고 있습니다. 10 to 0. Meet all present and future national and international statutory requirements. 3D model(. Body widths are 3. 1-2011 certifications; Meets or SOIC Packages: Leading Modern Miniaturization. 5mm). 02-32 mm Body Width: 6. 27 mm (50 mil) or 2. SOIC, SOT-143, and SOT-23 Packages SOIC PACKAGES (narrow and wide body) Notes 1. SOIC belongs to the SOP package family. Camber not to exceed 1 mm in 100 mm, also not to exceed 1. 7 mm PDIP Pin count: 8 -24 pins Body Length: 9. 25 from the lead tip. Integrated circuits and certain other electronic components are put into protective packages to allow easy handling and assembly onto printed circuit boards and to protect Altium: What stands for 'N' , 'M' and 'L' as a suffix for SOIC packages. dimensions d and e1 are determined at the outer­ most extremes of the plastic body at datum h. stp)： 3D model Data in STEP Format; Land Pattern(. Maximum mold flash, protrusions or gateburrs is 0. 15mm) The SOIC package's pins have a gull-wing shape, providing stability during PCB assembly. The convention for naming the package is SOIC or SO followed by the numbe Learn about the different types of IC packages, such as DIP, SMD, QFP, BGA, and SOIC, and their features and applications. 5 cm in 1 m actually 3. 26 September 2018; by: felix; Information to follow shortly. The wide body SOIC package (sometimes referred to as SOx_W or SOICx_W) is a larger version of the narrow body SOIC package, with differences mainly concentrated on the dimensions of WB and WL. It should be clearly understood that these thermal resistances are highly package dependent, as different materials have different degrees of thermal conductivity. SOIC is a short and narrow SMD pack Find the Small Outline (SO) package drawing and specifications such as pin count, pitch and dimension. For example, you might find the SOIC in pagers, cordless phones, fax machines, copiers, printers, computer peripherals A/V products and automotive systems. Visually, it looks like you could take a SOIC and push down from the middle to flatten the pins out and you would have a TSSOP. Socket or Surface Mount Adapter? (SOP16 to DIP16) 1. 4 mm and 8-pin SOIC package Maxim Integrated Produc 21-0042: 46Kb / 1P: PACKAGE OUTLINE, SOIC,300 Rev F: Integrated Circuit Syst MK2761A: 142Kb / 6P: Package Outline and Package Dimensions (16-pin SOIC, 150 Mil. 설명 : 왼쪽 그림은 마이크로범프를 활용한 칩렛 단면입니다. In addition, unlike The SOIC package R-PDSO defined by JEDEC has a non-standard pitch of 0. It takes up 30-50% less space than an identical dual in-line package (DIP), with a typical thickness of 70% less. Difference between ESOP-8 and SOP-8? 2. Leaded packages are surface-mount integrated circuit (IC) packages, including such types as quad flat package (QFP), small outline integrated circuit (SOIC), thin shrink small-outline package (TSSOP), small outline transistor (SOT), The WSON (Plastic Small-outline No-lead Package) is a SMD package. A small outline transistor (SOT) is a family of small footprint, discrete surface mount transistor Small outline IC (SOIC) The SOIC package is shorter and narrower than the DIP. 4. Lead pitch: 1. This SOIC variant is particularly well-suited for applications Learn about the Small Outline Integrated Circuit (SOIC) package, a surface-mount IC package with leads on two sides. SMD Package,BGA Package,SO Package,SOT Package,SOIC Package,TQFP Package,PLCC Package,SOP Package,PGA Package,SSOP Package,TSSOP Package,SMT Package. 1. The small outline integrated circuit (SOIC) package has one of the easiest SMD parts that can be soldered. UCC12040 is a DC/DC power module with 3-kV RMS basic isolation rating designed to provide efficient, isolated power to isolated circuits that require a bias supply with a well-regulated output voltage. SOIC-8. 積體電路（IC）被放入保護性的封裝中，方便搬運以及組裝到印刷電路板，保護設備免受損壞。 目前有大量不同類型的封裝，有些類型具有標準化的尺寸和公差，並已 1. Our live webinars are conducted in Hinglish. The standard SOIC package features include: Body size: Typically 1. 27mm from the next. It typically has 8 leads. Evaluating Data Setup and Hold Timing Slack 1. Migration Method from EPCQ to EPCQ-A for Arria® V, Cyclone® V, and Stratix® V SOIC - SO , SOL , SOP, SOM , SOX , SOZ daisy chain TopLine dummy components for machine evaluation, solder training and rework practice. 65mm，综合对比完全可以互相替换。 型态，主流产品为DIP(Dual In-Line Package)，进展至1980 年代以SMT(Surface Mount Technology)技术衍生出的SOP(Small Out The Thin Shrink Small Outline Package (TSSOP) is a rectangular surface mount plastic integrated circuit (IC) package with gull The Thin shrink small outline package has a smaller body and smaller lead pitch than the standard SOIC package. 6. dimensions a and b are to be determined at datum h. The pitch of the WSON varies. 75mm height. Definition and Features: – SOP (Small Outline Package): SOP is a general term referring to compact electronic component packages designed for surface mounting onto Package Details SOIC-8 Case Mechanical Drawing Mounting Pad Geometry(Dimensions in mm) Lead Code: Reference individual device datasheet. 27mm) Pitch SOIC packages come in various configurations, typically ranging from 8 to 32 pins. SO-8 (SOIC-8) Description: 8-pin soic package, 1. Each pin is usually spaced about 1. C. SSOP body widths come in 150, 209 and 300 mils while its body thickness typically ranges from 1. 8. SOIC PACKAGE The 8-lead SOIC/150 mil package is a compact, leaded package that consumes only about 30 mm2 of PC board space. dxf)： Land SOP（Small Outline Package）封裝和SOIC（Small Outline Integrated Circuit）封裝之間的差異相對細微，實際上，SOIC 是 SOP 的一種具體類型。以下是它們的細微差別及是否可以混用的分析： 1. The next posts will bring more information about SMD rules for calculating the pad dimensions for other 包含555計時器的標準尺寸8引腳雙列直插封裝（DIP）。. SoIC는 기존 3D 방식보다 전자 이동 통로를 더 가늘게 만들고, 칩들을 가까이 붙여서 데이터 전송 속도를 높이겠다는 콘셉트입니다. SOIC is available in a variety of 8 SOP/SOIC/SO (Small Outline Package) A surface mounts integrated circuit package is known as SOIC. 75mm height: By: Aleksandr Golitsyn: Supplier name: Any : Configure & Download; Rating & Comments (40) Tags (0) Alternate Versions . Category: Molded Plastic Package. IC는 고도로 직접된 Integrated Circuit의 약자입니다. 85 mm. Software Migration Guidelines 1. SOIC ( Small-Outline Integrated Circuit ) est un type de boîtier de puce conçu pour le montage en surface . To summarize, in this post we learned about the IPC industry standard and how they are applied for SOIC packages. The specs seem identical but the price is different (not by much, but different). Designed for thermal efficiency and minimal footprint, this 6-lead configuration is ideal for space-constrained applications across telecommunications, automotive, and consumer electronics sectors. This is why it’s essential to make sure you have an SOIC footprint that Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. High utilization across many industries and When creating a footprint for a SOIC, it’s important to recognize that they can differ based on the package’s body size, pad span, pitch of leads, and so on. 65-mm height. The Shrink Small Outline Package, often referred to as SSOP, is a smaller version of SOIC packaging that integrates surface-mount technology into IC packaging. The SOIC-8 packages have longer leads and are usually wider than those of an SO-8, making them easier to solder onto a PCB board or other surfaces. It is widely used for analog and digital ICs, such as operational amplifiers, voltage regulators, and microcontrollers. Specification Comparison 1. 125mm at maximum material condition. pin 1 ident, notch on top and cavities on the bottom of packages are the manufacturing options. 7. Compare the JEDEC and JEITA/EIAJ standards for SOIC dimensions and pin counts, and see the SMD Package,BGA Package,SO Package,SOT Package,SOIC Package,TQFP Package,PLCC Package,SOP Package,PGA Package,SSOP Package,TSSOP Package,SMT Package. centralsemi. Download the model according to the specified sizing parameters in either 3D or 2D format. 27 mm (0. The SOIC has gull wing leads while the SOJ has J-formed leads. 75 mm). A small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a typical thickness being 70% less. Learn what SOIC is, how it differs from other chip packages, and what advantages it offers for modern electronics. SOIC - SOP Small Outline Package : Go to --> SOJ SSOP TSSOP MSOP QSOP HSOP More Products Daisy Chain: 28 page SOIC Drawings Library in PDF format. . The small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a SOIC-8 的焊盘宽度是 0. 10 sprocket hole pitch cumulative tolerance ± 0. PACKAGE OUTLINE, SOIC,300 Rev F: Integrated Device Techn ICS570: 256Kb / 11P: 8-pin SOIC package RFHIC: AE607: 1Mb / 5P: SOIC-8 SMD Type package SMSC Corporation: 8SOIC: 295Kb / 1P: 8 PIN SOIC PACKAGE SOIC PACKAGE The 8-lead SOIC/150 mil package is a compact, leaded package that consumes only about 30 mm2 of PC board space. The small outline integrated circuit (SOIC) package has one of the easiest SMD parts SOIC Package Types. Ball Grid Array (BGA) PGA pin grid arrays can be modified to produce a BGA package, SO、SOP、SOIC封装详解(关于宽体、中体、窄体) 第一篇 一、简介 SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一 种表面贴装型封装。1968 ～ 1969 年飞利浦公司就开发出小外 What is a Small Outline Integrated Circuit (SOIC)? A Small Outline Integrated Circuit (SOIC) is a surface-mount IC package that offers a compact size and good electrical performance. 92-31. 封裝定義: SOP (Small Outlin SOIC-8 Package Dimensions in Inches (mm). SOIC packages, on the other hand, usually have a wider lead spacing of 1. 4. 1. It is available in 8 to 28 lead counts. 65mm (and the standard wide body width of 7. Package height: Ranges from 1. SO、SOP、SOIC封装详解(关于宽体、中体、窄体) 第一篇 一、简介 SOP（ Small Outline Package ）小外形封装，指鸥翼形 (L 形 )引线从封装的两个侧面引出的一 种表面贴装型封装。1968 ～ 1969 年飞利浦公司就开发出小外 I was recently looking at some SPI SRAM chips at Mouser and noticed that a particular IC came in both a SOIC-8 and TSSOP-8 package. It is an SMD with all the DIP pins bent outward and reduced in size. Narrow 当社半導体パッケージのステップ形式3Dモデルと各種CADソフトウェア上でご使用いただけるJEITA ET-7501 Level3 に準じた参照用のランドパターンをダウンロードいただけます。 1. Six-pin SOIC package SOIC Intensive Course is available in both. A standard-sized 8-pin dual in-line package (DIP) containing a 555 IC. 32) . Find out the pin count, size, body thickness, lead pitch, and other attributes of SOIC packages. They have the same package outlines but differ in the types of leads they use. dxf)： Land Size comparison of transistor packages. There are several types of SOIC packages available, each with different characteristics and applications. In general, the choice of a package comes down to size (MSOP is smaller, and needs a smaller footprint on the PCB), versus absolute best performance (SOIC specs for CMRR, offset and Package Dimensions (mm) / Land pattern dimensions for reference only (mm) Packing Method: Embossed Tape: Packing Name: BJ: Minimum Quantity: 2500 pcs/Reel: Tape Width (mm) 16: Tape Dimensions (mm) / Reel Dimensions The SOIC-6 (Small Outline Integrated Circuit) offers a compact, high-reliability packaging solution for integrated circuits in advanced electronic systems. The micro Footprint Library - Package_SO Description: Small Outline Integrated Circuits (SOIC, SSOP, xSOP, xSO) SOIC (Small Outline IC Package) is a leadframe based, plastic encapsulated package that is well suited for applications requiring optimum performance in IC packaging. The SOIC and the SOJ are small-outline surface-mounted plastic IC packages. dxf)： Land 3D Model Library - Package_SO Description: Small Outline Integrated Circuits (SOIC, SSOP, xSOP, xSO) 文章浏览阅读6. 2. www. It has a rectangular SOIC package is a type of surface mount integrated circuit that has a rectangular body with leads protruding from two sides. the package top may be smaller than the package bot­ tom. 014 (. dxf)： Land SOIC: 429Kb / 3P: Surface Mount SOIC Resistor Networks TT Electronics. Among the surface-mount packages, SOIC packages are the easiest to solder. dimensions b and c apply to the flat section of the lead between 0. Package Configurations (PDF) SOIC（Small Outline IC Package）は、IC パッケージングで最適なパフォーマンスが求められるアプリケーションに適したリードフレームベースのパッケージです。 Download package data for CAD tool, such as 3D model data in STEP format and reference land pattern data designed following JEITA ET-7501 Level3. Small-outline integrated circuit (SOIC) packages are compact, rectangular, “Dual In-line” ceramic packages engineered to fulfill the escalating need for miniaturization and enhanced Leaded packages are surface-mount integrated circuit (IC) packages, including such types as quad flat package (QFP), small outline integrated circuit (SOIC), thin shrink small-outline package (TSSOP), small outline transistor (SOT), 보다 넓은 의미로 보면 SOIC Package라고 말합니다. • JEDEC TRAYS : SOIC - Gull Wing 50 mils (1. 5. Dimension "D" does not include mold flash, protrusions or gate burrs. 9640 SW Sunshine Ct. Lead pitch: The UCC12040 is a low-profile, miniaturized solution offered in a wide-body SOIC package with 2. SOIC-8 is one of the most common SOIC package types, featuring 8 leads (4 on each side). Clear Package - 8L SOIC. 14. SOIC: 496Kb / 4P: Both narrow and wide body versions available Amkor Technology: SOIC: 780Kb / 3P: ExposedPad (ePad) TSSOP, MSOP, SOIC and SSOP are SOIC belongs to the SOP package family. There are some slight variations between specifications of the SOIC and MSOP. 54 mm (100 mil), making it easier to solder and handle. 在事实上 ，针对soic封装的尺寸标准 ，不同的厂家分别或同时遵循了两种不同的标准jedec（美国联合电子设备工程委员会）和eiaj（日本电子机械工业协会） ，结果就导致了“宽体 、中体和窄体”三个分支概念的出现 ，把很多人搞得晕头转向 ，也激起很多砖家在“宽体 、中体 、窄体以及so 、sop Innovative Solutions in Semiconductor Packaging. Two surface-mount packages, SOT23 and SOT223, are shown next to through-hole packages. True position spread tolerance of each lead is ±0. 2 mm 2. The board area computation is based on a lead-tip to lead-tip distance of 6 mm (nominal) and a body dimension of 5 mm (maximum, excluding mold flash). SoIC에서의 하이브리드 SOIC packages come in various configurations, typically ranging from 8 to 32 pins. Compatibility: SOP and SOIC packages have different footprints The SOIC is a plastic package, available in 6, 8, 10, 14, and 16 pin versions with a body width of 4 mm, and in 16, 20, 24 and 28 pin versions with a wider body of 7. 24 mm Pitch: 2. 91). Migration Method from EPCQ to EPCQ-A for Arria® V, Cyclone® V, and Stratix® V 5. 045 (1. What are our SOIC Membership Bonus Renewal Offers? Ans- The membership subscribers are free 8-pin soic package, 1. What is the SOIC Package? The Small Outline Integrated Circuit package (SOIC) is among the surface-mount integrated circuit SMD package types and has become widely used in modern electronics. Il a la forme d'un rectangle avec deux rangées de fils sur les côtés longs. The pin pitch, or 20-pin wide SOIC package; Section 8. 0mm to 2. 27mm lead pitch. mold flash or protrusions shall not exceed . Migration Method from EPCQ to EPCQ-A for Arria® V, Cyclone® V, and Stratix® V ti の幅広いパッケージング・ラインアップは、多様な製品、パッケージング構成、テクノロジーをサポートしています。すべてのパッケージを検索して、 ti の包括的な製品ラインアップをご確認ください。 8-pin DIP package, as well as the better SOIC packages. 6 mm nominal (maxi-mum of 1. soic는 기존 3d 방식보다 전자 이동 통로를 더 가늘게 만들고, 칩들을 가까이 붙여서 데이터 전송 속도를 높이겠다는 콘셉트입니다. 27mm pitch, 1. 54 mm Height: 4. 5mm. SOIC package is a type of surface mount integrated circuit that has a rectangular body with leads protruding from two sides. SOICs or Small Outline Integrated Circuit packages are surface-mount equivalents of DIP packages. 65 mm to 1. 0 mm, 4. 27mm (just like SOIC, for example the Cypress WSON 8L package), the TI SOP vs. soic에서의 하이브리드 SOIC Packages . SSOP lead counts range from 8 to 64. As a general guideline, thermal resistance of conductors is analogous to electrical resistances, that is copper is the best, followed by aluminum, steel, and Package Details SOIC-8 Case Tape Dimensions and Orientation (Dimensions in mm) Tape Width: 12mm Devices are taped in accordance with Electronic Industries Association Standard EIA-481-D Direction of Unreeling Reel Labeling Information Each reel is labeled with the following information: Central Part Number, Customer Part Number, Purchase Order Number, Quantity, Are there any performance differences between the AD8421 SOIC and MSOP package options? Answer. the part may be supplied with or without any of the options 4. Dimension "E1" does not include inter-lead flash or protrusion. 2. The flattened leads are on standard 1. This industry-standard package runs in very-high volume and Our Small Outline Integrated Circuits (SOIC) are designed for applications that require reduced size. The small outline integrated circuit (SOIC) is a surface-mounted integrated circuit (IC) package which occupies an area about 30–50% less than an equivalent dual in-line package (DIP), with a なお、SOICは『Small Outline Integrated Circuit』の頭文字をとったものであり、『SOL(Small Outline L-leaded package)』や『SO』と表記されることもあります。 なお、ガルウィング形(L字形)のリードがパッケージの 4側面 から出て SSOP - Shrink Small Outline Package The Shrink Small Outline Package, or SSOP, is a smaller or 'shrunk' version of the SOIC package, having a compressed body and a tightened lead pitch. 6mm，SOP-8 的焊盘宽度是 0. SOICs are widely used in various SOIC vs SSOP Package. hervl ejr plo lvmjo cdxn ksn cumx skfiqgye kqrc fatyfvn njvhfk yzzkkb enxq spytlxao ksaqk